1. Volinsky, A.A., Gerberich, W.W.: Nanoindentation techniques for assessing mechanical realiability at the nanoscale. Microelectron. Eng. 69, 519–527 (2003)
2. Yong, Z., et al.: Measurement of Young’s modulus and residual stress of copper film electroplated on silicon wafer. Thin Solid Films 460(1), 175–180 (2004)
3. Гoлoвин, Ю.И.: Bвeдeниe в нaнoтexникy. Mocквa: Maшинo-cтpoeниe (2007)
4. Pharr, G.M., Oliver, W.C., Clarke, D.R.: The mechanical behavior of silicon during small-scale. J. Electr. Mat. 19(9), 881–887 (1990)
5. Grabco, D., Pyrtsac, C., Shikimaka, O.: Deformation under nano/microindentation of LiF, MgO, Si monocrystals stipulated as support materials for Cu/substrate structures. In: Proceeding of ICNBME-2013 Chisinau Moldova, pp. 102–106 (2013)