EXPLAINS: Explainable Anomaly Prediction for SMT Solder Joints Using SPI Data-Reference-Cited by-同舟云学术

EXPLAINS: Explainable Anomaly Prediction for SMT Solder Joints Using SPI Data

Published:2023-08-24 Issue: Volume: Page:487-495
ISSN:2195-4356
Container-title:Flexible Automation and Intelligent Manufacturing: Establishing Bridges for More Sustainable Manufacturing Systems
language:
Short-container-title:

Author:

Cao Nieqing,Won Daehan,Yoon Sang Won

Publisher

Springer Nature Switzerland

Link

https://link.springer.com/content/pdf/10.1007/978-3-031-38241-3_55

Reference9 articles.

1. Ellis, J.R., Masada, G.Y.: Dynamic behavior of SMT chip capacitors during solder reflow. IEEE Trans. CHMT 13(3), 545–552 (1990)

2. Krammer, O.: Modelling the self-alignment of passive chip components during reflow soldering. Microelectron. Reliab. 54(2), 457–463 (2014)

3. Pan, K., Ha, J.H., Wang, H., Xu, J., Park, S.: An analysis of solder joint formation and self-alignment of chip capacitors. IEEE Trans. CPMT 11(1), 161–168 (2020)

4. Chang, Y.M., Wei, C.C., Chen, J., Hsieh, P.: An implementation of health prediction in SMT solder joint via machine learning. In: International Conference on BigComp, pp. 1–4. IEEE, Kyoto (2019)

5. Wu, H., Zhang, X., Kuang, Y., Ouyang, G., Xie, H.: Solder joint inspection based on neural network combined with genetic algorithm. Optic 124(20), 4110–4116 (2013)

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PADS: Predictive Anomaly Detection for SMT Solder Joints Using Novel Features From SPI and Pre-AOI Data;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03