Author:
Ginzburg Valeriy V.,Yang Jian
Publisher
Springer International Publishing
Reference93 articles.
1. A.L. Moore, L. Shi, Mater. Today 17, 163 (2014)
2. X.C. Tong, Advanced Materials for Thermal Management of Electronic Packaging, vol. 30, 1st edn. (Springer, New York, 2011)
3. P.K. Schelling, L. Shi, K.E. Goodson, Mater. Today 8, 30 (2005)
4. F. Sarvar, D.C. Whalley, P.P. Conway, in 2006 1st Electronic Systemintegration Technology Conference (IEEE, 2006), p. 1292
5. H. Chen, V.V. Ginzburg, J. Yang, Y. Yang, W. Liu, Y. Huang, L. Du, B. Chen, Prog. Polym. Sci. 59, 41 (2016)
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献