Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction-Reference-Cited by-同舟云学术

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Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction

Published:2024 Issue: Volume: Page:217-228
ISSN:1612-3956
Container-title:Mathematics in Industry
language:en
Short-container-title:

Author:

Zawra Ibrahim,Zaal Jeroen,Soestbergen Michiel van,Hauck Torsten,Rudnyi Evgeny,Bechtold Tamara

Publisher

Springer Nature Switzerland

Link

https://link.springer.com/content/pdf/10.1007/978-3-031-54517-7_25

Reference18 articles.

1. Antoulas, A.C.: Approximation of Large-Scale Dynamical Systems. Society for Industrial and Applied Mathematics (2009)

2. Schilders, W., Van der Vorst, H., Rommes, J.: Model order reduction: theory, research aspects and applications. In: Mathematics in Industry Series, vol. 13 (2008). Springer, GermanyModel order reduction: theory, research aspects and applications. ISBN: 978-3-540-78840-9. https://doi.org/10.1007/978-3-540-78841-6

3. Benner, P.: Volume 1: System- and Data-Driven Methods and Algorithms. De Gruyter, Berlin (2021). ISBN:9783110498967. https://doi.org/10.1515/9783110498967

4. Benner, P.: Volume 2: Snapshot-Based Methods and Algorithms. De Gruyter, Berlin (2021). ISBN:9783110671490. https://doi.org/10.1515/9783110671490

5. Benner, P.: Volume 3: Applications. De Gruyter, Berlin (2021). ISBN:9783110499001. https://doi.org/10.1515/9783110499001

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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