Author:
Abali Bilen Emek,Aldakheel Fadi,Zohdi Tarek I.
Publisher
Springer International Publishing
Reference40 articles.
1. Solomon, H. D. (1991). Predicting thermal and mechanical fatigue lives from isothermal low cycle data. In Solder Joint Reliability (pp. 406–454).
2. Ridout, S., & Bailey, C. (2007). Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30(5), 400–412.
3. Roellig, M., Dudek, R., Wiese, S., Boehme, B., Wunderle, B., Wolter, K.-J., & Michel, B. (2007). Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectronics Reliability, 47(2), 187–195.
4. Atli-Veltin, B., Ling, H., Zhao, S., Noijen, S., Caers, J., Weifeng, L., Feng, G., & Yuming, Y. Thermo-mechanical investigation of the reliability of embedded components in pcbs during processing and under bending loading. In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 (pp. 1–4). IEEE.
5. Emek Abali, B., Lofink, P., & Müller, W. H. (2014). Variation of plastic materials data of copper and its impact on the durability of Cu-via interconnects. In R. Aschenbrenner & M. Schneider-Ramelow (Eds.), Microelectronic packaging in the 21st century (Chapter 7.2, pp. 305–308). Fraunhofer Verlag.