Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-92964-0_15
Reference12 articles.
1. Hu R, Luo X, Zheng H et al (2012) Design of a novel freeform lens for LED uniform illumination and conformal phosphor coating. Opt Express 20(13):13727. https://doi.org/10.1364/oe.20.013727
2. Alim MA, Abdullah MZ, Aziz MA et al (2020) Experimental study on luminous intensity of white LEDs of different configurations. IOP Conf Ser Mater Sci Eng 1007(012145). http://doi.org/10.1088/1757-899X/1007/1/012145
3. Wang L, Weelden TV, Yuan C, Wei J (2015) LED encapsulation and integration with film assisted molding technology. In: 2013 10th China international forum on solid state lighting, ChinaSSL 2013, pp 89–94. http://doi.org/10.1109/SSLCHINA.2013.7177321
4. Mani AA, Moulin G, Gasse A, Mendizabal L, Consonni M, Henry D (2016) Innovative process development for LEDs dome shaping without molding. In: 2016 6th electronic system technology conference, ESTC 2016. http://doi.org/10.1109/ESTC.2016.7764503
5. Chen K, Zhang R, Lee SWR (2010) Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging. In: Proceedings—2010 11th international conference on electronic packaging technology and high density packaging, ICEPT-HDP 2010, pp 1386–1392. http://doi.org/10.1109/ICEPT.2010.5582822
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