Intracortical Electrodes
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-41854-0_4
Reference72 articles.
1. Ainslie, K. M., & Desai, T. A. (2008). Microfabricated implants for applications in therapeutic delivery, tissue engineering, and biosensing. Lab on a Chip, 8(11), 1864–1878. https://doi.org/10.1039/b806446f .
2. Bhandari, R., Negi, S., Rieth, L., Normann, R. A., & Solzbacher, F. (2008). A novel method of fabricating convoluted shaped electrode arrays for neural and retinal prostheses. Sensors and Actuators A: Physical, 145–146(1–2), 123–130. https://doi.org/10.1016/j.sna.2007.10.072 .
3. Bhandari, R., Negi, S., & Solzbacher, F. (2010). Wafer-scale fabrication of penetrating neural microelectrode arrays. Biomedical Microdevices, 12(5), 797–807. https://doi.org/10.1007/s10544-010-9434-1 .
4. Bouton, C. E., Shaikhouni, A., Annetta, N. V., Bockbrader, M. A., Friedenberg, D. A., Nielson, D. M., Sharma, G., Sederberg, P. B., Glenn, B. C., Mysiw, W. J., Morgan, A. G., Deogaonkar, M., & Rezai, A. R. (2016). Restoring cortical control of functional movement in a human with quadriplegia. Nature, 533(7602), 247–250. https://doi.org/10.1038/nature17435 .
5. Brandman, D. M., Cash, S. S., & Hochberg, L. R. (2017). Review: Human intracortical recording and neural decoding for brain-computer interfaces. IEEE Transactions on Neural Systems and Rehabilitation Engineering, 25(10), 1687–1696. https://doi.org/10.1109/TNSRE.2017.2677443 .
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