Low Pressure, Solvent-Assisted Thermal Bonding of PMMA–PMMA Substrates for Microfluidics Device Fabrication
Author:
Publisher
Springer Nature Switzerland
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-29348-1_4
Reference9 articles.
1. Chiang CC, Immanuel PN, Chiu YH, Huang SJ (2021) Heterogeneous bonding of pmma and double-sided polished silicon wafers through H2O plasma treatment for microfluidic devices. Coatings 11(5)
2. Faghih MM, Sharp MK (2019) Solvent-based bonding of PMMA–PMMA for microfluidic applications. Microsyst Technol 25(9):3547–3558
3. Giri K, Tsao C (2022) Recent advances in thermoplastic microfluidic bonding. Micromachines (basel) 13(3):486
4. Song IH, Park T (2017) PMMA solution assisted room temperature bonding for PMMA–PC hybrid devices. Micromachines 8(9):284
5. Toossi A, Moghadas H, Daneshmand M, Sameoto D (2015) Bonding PMMA microfluidics using commercial microwave ovens. J Micromech Microeng 25(8):5008
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