A Soft Robotic Cover with Dual Thermal Display and Sensing Capabilities
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-71151-1_23
Reference13 articles.
1. Bouyarmane, K., Caron, S., Escande, A., Kheddar, A.: Multi-contact planning and control. In: Goswami, A., Vadakkepat, P. (eds.) Humanoid Robotics: A Reference, pp. 1763–1804. Springer, Dordrecht (2019)
2. Drif, A., Citerin, J., Kheddar, A.: Thermal bilateral coupling in teleoperators. In: IEEE/RSJ International Conference on Intelligent Robots and Systems, pp. 1301–1306 (2005). https://doi.org/10.1109/IROS.2005.1545403
3. Goetz, D.T., Owusu-Antwi, D.K., Culbertson, H.: Patch: pump-actuated thermal compression haptics. In: IEEE Haptics Symposium, pp. 643–649 (2020)
4. Guiatni, M., Benallegue, A., Kheddar, A.: Learning-based thermal rendering in telepresence. In: Ferre, M. (ed.) Haptics: Perception, Devices and Scenarios, pp. 820–825. Springer, Heidelberg (2008)
5. Holman, J.P.: Heat Transfer, vol. 1. McGraw-Hill Inc., New York (1990)
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