OCR System For Recognition of Used Printed Components For Recycling
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-41862-5_50
Reference12 articles.
1. Electronic Components (EC) Reuse and Recycling—A New Approach towards WEEE Management Procedia Environmental Sciences 35 (2016) 656–668 1878-0296 © 2016 the Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). Peer-review under responsibility of the organizing committee of 5IconSWM 2015. doi: https://doi.org/10.1016/j.proenv.2016.07.060. Available online at www.sciencedirect.com Science Direct International Conference on Solid Waste Management, 5IconSWM 2015 Biswajit Debnatha,*, Priyankar Roychowdhuryb, Rayan Kundu.
2. RauH, Wu CH. Automatic optical inspection for detecting defects on printed circuit board inner layers. Int J Adv Manuf Technol 2005;25:940–6, https://doi.org/10.1007/s00170-004-2299-9.
3. Sheau-Chyi Lee, Serge Demidenko,Kok-Hua Lee, IC handler Throughput Evaluation for Test Process Optimization, IEEE Instrumentation & Measurement Technology Conference, May 2007.
4. Automated visual inspection of surface mount PCBsTeoh, E.K.; Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore; Mital, D.P.; Lee, B.W.; Wee, L.K. Industrial Electronics Society, 1990. IECON ‘90, 16th Annual Conference of IEEE, Date of Conference: 27–30 Nov 1990, Page(s): 576–580 vol. 1, Meeting Date: 27 Nov 1990–30 Nov 1990, Print ISBN: 0-87942-600-4, INSPEC Accession Number: 4101854, Conference Location: Pacific Grove, CA, DOI:https://doi.org/10.1109/IECON.1990.149205, Publisher: IEEE
5. R. Nagarajan, Sazali Yaacob, Paulraj Pandian, M. Karthigayan, Shamsudin H.J. Amin, and Marzuki Khalid. A real time marking inspection scheme for semiconductor Industries. The International Journal of Advanced Manufacturing Technology. 34(9–10):926–932, August 2006
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