Author:
Ben Ameur Sirine,Yaich Ahmed,Elhami Abdelkahalk,Beyaoui Moez,Saouab Abdelghani,Haddar Mohamed
Publisher
Springer Nature Switzerland
Reference22 articles.
1. Swapna, Y., Harsha, K.S.: IOP Conf. Ser.: Mater. Sci. Eng. 1185 012035 (2021)
2. Navuri, K., Eswara, K.A., Beulah, M.P., Satya Krishna, B.: Random vibration analysis of mechanical hardware of flight data recorder. ARPN J. Eng. Appl. Sci. 11(18), 2016 (2016)
3. Wei, Q., Zhang, H., Sun, W., Li, W.: Stress response of the hydraulic composite pipe subjected to random vibration. Compos. Struct. 255, 112958 (2021)
4. Anuara, M.A., Mat Isaa, A.A., Ummi, Z.A.R.: Modal characteristics study of CEM-1 single-layer printed circuit board using experimental modal analysis. Procedia Eng. 41, 1360–1366 (2021)
5. Jayaraman, S., Trikha, M., Somashekar, K.D., Ravindra, M.: Response spectrum analysis of printed circuit boards subjected to shock loads. Procedia Eng. 144, 1469–1476 (2016)