Effect of Changes in Phase and Grain Interface on Physical Properties During Aging of Ultra-Deformation Cu-Ag Alloy Wires
Author:
Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-92381-5_134
Reference14 articles.
1. Raju KS, Sarma VS, Kauffmann A et al (2013) High strength and ductile ultrafine-grained Cu–Ag alloy through bimodal grain size, dislocation density and solute distribution. Acta Mater 61(1):228–238
2. Satoshi S, Yasuyuki K, Takayuki T et al (2018) High strength and high electrical conductivity Cu-Ti alloy wires fabricated by aging and severe drawing. Metall Mater Trans A 49(10):4956–4965
3. Blank E , Kaspar M , Rappaz M (1985) Work hardening due to internal stresses in dendritic microstructures—science direct. Strength Met Alloy (ICSMA 7) 87–92
4. Jenő G (2013) Defect structure in ultra ne-grained silver and a copper-silver alloy processed by severe plastic deformation
5. Jakani S, Baudin T, Novion CHD et al (2007) Effect of impurities on the recrystallization texture in commercially pure copper-ETP wires. Mater Sci Eng A 456(1–2):261–269
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