Stress Computation and Reduction by Cyber-Physical Systems Controlling Printed Circuit Board Manufacturing Technology
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-66081-9_4
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3. Tong, J.P.C., Tsung, F., Yen, B.P.C.: A DMAIC approach to printed circuit board quality improvement. Int. J. Adv. Manuf. Technol. 23(7), 523–531 (2004). https://doi.org/10.1007/s00170-003-1721-z
4. Samavatian, M., Ilyashenko, L.K., Surendar, A., Maseleno, A., Samavatian, V.: Effects of system design on fatigue life of solder joints in BGA packages under vibration at random frequencies. J. Electron. Materi. 47(11), 6781–6790 (2018). https://doi.org/10.1007/s1166
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