Phase-field simulation of phase separation coupled with thermodynamic databases in FeNiCrCoCu high-entropy alloys
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Link
https://link.springer.com/content/pdf/10.1007/s00339-022-06101-y.pdf
Reference46 articles.
1. J.W. Yeh, S.K. Chen, S.J. Lin, J.Y. Gan, T.S. Chin, T.T. Shun, C.H. Tsau, S.Y. Chang, Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes. Adv. Eng. Mater. 6, 299–303 (2004)
2. B. Cantor, I. Chang, P. Knight, A. Vincent, Microstructural development in equiatomic multicomponent alloys. Mater. Sci. Eng. A 375, 213–218 (2004)
3. D.B. Miracle, O.N. Senkov, A critical review of high entropy alloys and related concepts. Acta Mater. 122, 448–511 (2017)
4. Z. Li, S. Zhao, R.O. Ritchie, M.A. Meyers, Mechanical properties of high-entropy alloys with emphasis on face-centered cubic alloys. Prog. Mater Sci. 102, 296–345 (2019)
5. G. Laplanche, A. Kostka, O. Horst, G. Eggeler, E. George, Microstructure evolution and critical stress for twinning in the CrMnFeCoNi high-entropy alloy. Acta Mater. 118, 152–163 (2016)
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3. Grain boundary segregation-induced strengthening-weakening transition and its ideal maximum strength in nanopolycrystalline FeNiCrCoCu high-entropy alloys;International Journal of Mechanical Sciences;2023-01
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