Short and ultrashort pulsed laser-based micro-scribing of copper film on a dielectric substrate for functional devices
Author:
Funder
Ministry of Education towards the Centre of Excellence for Advanced Laser Material Processing and the IC&SR at IIT Madras
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Link
https://link.springer.com/content/pdf/10.1007/s00339-022-06181-w.pdf
Reference28 articles.
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3. K. Woo, C. Bae, Y. Jeong, D. Kim, J. Moon, Inkjet-printed Cu source/drain electrodes for solution-deposited thin film transistors. J. Mater. Chem. 20(19), 3877–3882 (2010)
4. J.C. Aurich, D. Dornfeld, P.J. Arrazola, V. Franke, L. Leitz, S. Min, Burrs—analysis, control and removal. CIRP Ann. 58(2), 519–542 (2009)
5. G. D’Urso, G. Maccarini, M. Quarto, C. Ravasio, M. Caldara, Micro-electro discharge machining drilling of stainless steel with copper electrode: the influence of process parameters and electrode size. Adv. Mech. Eng. 8(12), 1687814016676425 (2016)
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