Author:
Kim H.,Duocastella M.,Charipar K. M.,Auyeung R. C. Y.,Piqué A.
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Reference13 articles.
1. S.F. Al-Sarawi, D. Abbott, P.D. Franzon, IEEE Trans. Compon. Packaging Manuf. Technol., B Adv. Packaging 21, 2 (1998)
2. A.W. Topol, D.C. La Tulipe Jr., L. Shi, D.J. Frank, K. Bernstein, S.E. Steen, A. Kumar, G.U. Singco, A.M. Young, K.W. Guarini, M. Ieong, IBM J. Res. Dev. 50, 491 (2006)
3. C.-T. Ko, K.-N. Chen, Microelectron. Reliab. 53, 7 (2013)
4. A.C. Hübler, G.C. Schmidt, H. Kempa, K. Reuter, M. Hambsch, M. Bellmann, Org. Electron., Phys. Mater. Appl. 12, 419 (2011)
5. A. Piqué, R.C.Y. Auyeung, H. Kim, K.M. Metkus, S.A. Mathews, J. Laser Micro Nanoeng. 3, 163 (2008)
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