Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation-Reference-Cited by-同舟云学术

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Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation

Published:2023-03-13 Issue:4 Volume:129 Page:
ISSN:0947-8396
Container-title:Applied Physics A
language:en
Short-container-title:Appl. Phys. A

Author:

Wu Cheng-Da^ORCID,Liu Kai-Wei,Cheng Po-Chien

Funder

Ministry of Science and Technology, Taiwan

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,General Chemistry

Link

https://link.springer.com/content/pdf/10.1007/s00339-023-06558-5.pdf

Reference35 articles.

1. T.W. Kim, K.L. Suk, S.H. Lee, W. Paik, J. Nanomater. 2013, 534709 (2013)

2. W. Zhang, B. Zhao, C. Zou, Q. Zhai, Y. Gao, S.F.A. Acquah, J. Nanomater. 2013, 193725 (2013)

3. F.E. Atalay, D. Avsar, H. Kaya, V. Yagmur, S. Atalay, T. Seckin, J. Nanomater. 2011, 919853 (2011)

4. H.C. Cheng, C.F. Yu, W.H. Chen, J. Mater. Sci. 47(7), 3103 (2012)

5. B.D. Polat, N. Sezgin, O. Keles, K. Kazmanl, A. Abouimrane, K. Amine, J. Mater. Sci. 582, 688 (2013)

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1. Study on the process and microstructure of Fe34Mn13.5Al3Cr7.5Ni alloy prepared by spark plasma sintering based on elemental powder;Materials Today Communications;2023-12

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