Thermal stability of electroless NiMeP amorphous alloys-Reference-Cited by-同舟云学术

Thermal stability of electroless NiMeP amorphous alloys

Published:1995-08 Issue:8 Volume:24 Page:941-946
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Krasteva N.,Armyanov S.,Georgieva J.,Avramova N.,Fotty V.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02652965.pdf

Reference55 articles.

1. K. Parker,Plating & Surface Finishing, 79 (3) 29 (1992).

2. J.W. Dini, Electroless Nickel ’91, Orlando, FL, 20–22 November, 1991.

3. N. Krasteva, S. Armyanov and V. Fotty,Proc. II Intl. Symp. on Electrochemical Technology Applications in Electronics, ed. L. T. Romankiw et al., (Pennington, NJ: Electrochemical Society, Inc., 1993) PV 93-20, p. 504.

4. J. P. Randin et al.,J. Electrochemical Society 114,442 (1967).

5. J. Flechon, F. Marchizaud and G. Marchai,Rev. Phvs. Appl. 7, 169 (1972).

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