Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions-Reference-Cited by-同舟云学术

Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions

Published:2020-08-03 Issue:10 Volume:72 Page:3538-3546
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Yang Ting-Li,Liu Yu-chen,Yang Chih-han,Kuo Yi-kai,Lin Shih-kang^ORCID

Funder

Ministry of Science and Technology, Taiwan

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s11837-020-04302-5.pdf

Reference39 articles.

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3. S.K. Lin, C.F. Yang, S.H. Wu, and S.W. Chen, J. Electron. Mater. 37, 498 (2008).

4. S.W. Chen, C.H. Wang, S.K. Lin, and C.N. Chiu, J. Mater. Sci.: Mater. Electron. 18, 19 (2007).

5. S.W. Chen, C.H. Wang, S.K. Lin, C.N. Chiu, and C.C. Chen, JOM 59, 39 (2007).

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