1. JEDEC Standard jESD22-A112, “Moisture-Induced Stress Sensitivity for Plastic Packaged Surface Mount Devices” (1994).
2. JEDEC Standard jESD22-A113-A, “Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing” (1995).
3. IPC-SM-786A, “Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC′s” (Lincolnwood, IL, 1995).
4. M. Kitano et al., “Analysis of Package Cracking During Reflow Soldering Process,” Proc. 17th Int. Sym. Testing & Failure Analysis (1991), pp. 213–220.
5. G.S. Ganesan and H.M. Berg, “Model and Analyses for Solder Reflow Cracking Phenomenon in SMT Plastic Packages,” IEEE Trans. CHMT, 16 (8) (1993), pp. 940–948.