Role of an interface crack for the blistering mode of a stiff film on a compliant substrate-Reference-Cited by-同舟云学术

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Role of an interface crack for the blistering mode of a stiff film on a compliant substrate

Published:2021-11-16 Issue: Volume: Page:
ISSN:1547-0091
Container-title:Journal of Coatings Technology and Research
language:en
Short-container-title:J Coat Technol Res

Author:

Gu Peixia,Chen Xuejun^ORCID

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Springer Science and Business Media LLC

Subject

Colloid and Surface Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,General Chemistry

Link

https://link.springer.com/content/pdf/10.1007/s11998-021-00556-z.pdf

Reference36 articles.

1. Song, J, “Mechanics of Stretchable Electronics.” Curr. Opin. Solid State Mater Sci., 19 160–170 (2015)

2. Chen, X, Yin, J, “Buckling Patterns of Thin Films on Curved Compliant Substrates with Applications to Morphogenesis and Three-Dimensional Micro-Fabrication.” Soft Matter, 6 5667–5680 (2010)

3. Chung, JY, Nolte, AJ, Stafford, CM, “Surface Wrinkling: A Versatile Platform for Measuring Thin-Film Properties.” Adv. Mater., 23 349–368 (2011)

4. He, W, Han, M, Wang, S, Li, LA, Xue, X, “Micromechanics of Substrate-Supported Thin Films.” Acta Mech. Sinica, 34 381–391 (2018)

5. Cotterell, B, Chen, Z, “Buckling and Cracking of Thin Films on Compliant Substrates Under Compression.” Int. J. Fract., 104 169–179 (2000)

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