Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Modeling and Simulation
Reference47 articles.
1. Wu, J., Chen, F., Chen, G.: Positioning accuracy control of dual-axis dicing saw for machining semiconductor chip. Int. J. Adv. Manuf. Technol. 109(3), 2299–2310 (2020)
2. Chen, F., Ye, X., Yin, S., Ye, Q., Huang, S., Tang, Q.: Automated vision positioning system for dicing semiconductor chips using improved template matching method. Int. J. Adv. Manuf. Technol. 100, 2669–2678 (2019)
3. Domke, M., Egle, B., Stroj, S., Bodea, M., Schwarz, E., Fasching, G.: Ultrafast-laser dicing of thin silicon wafers: strategies to improve front-and backside breaking strength. Appl. Phys. A 123, 1–8 (2017)
4. Vesvikar, C., Singh, R., Joshi, S.S., et al.: Efficient dicing of silicon ingots for photovoltaic applications. In: 2010 35th IEEE Photovoltaic Specialists Conference, pp. 003629–003634. IEEE (2010)
5. Ilani, M.A., Khoshnevisan, M.: Mathematical and physical modeling of FE-SEM surface quality surrounded by the plasma channel within al powder-mixed electrical discharge machining of Ti-6Al-4V. Int. J. Adv. Manuf. Technol. 112, 3263–3277 (2021)
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