1. D. Neyl, V. Girault, X. Federspiel, Analytical extraction of thermal conductivities of low-k dielectrics for advanced technologies, in IEEE international integrated reliability workshop final report. (IEEE, 2004)
2. R. Singh, R. Sharangpani, K.F. Poole, M.M. Moslehi, Critical technology challenges in low power electronics, in Advanced semiconductor manufacturing conference. (IEEE, 1995)
3. C. Guedjrx, L. Baud, M. Fayolle, V. Jousseaume, J.F. Guillaumond, J. Cluzel, A. Toffoli, G. Reirnbold, D. Bowhu, Effect of pore sealing on the reliability of ULWCU interconnects (IEEE, 2004)
4. M.M. Nazir Ahmad, P.N. Ahmad, Kotru, RSC Adv. 5, 9380 (2015)
5. D. Shamiryan, T. Abell, F. Lacopi, K. Maex, Low-k dielectrics materials. Mater. Today 7, 34–39 (2004)