Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends-Reference-Cited by-同舟云学术

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Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends

Published:2016-01-19 Issue:5 Volume:27 Page:4399-4409
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Suhir E.,Ghaffarian R.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-016-4310-2.pdf

Reference67 articles.

1. J.R. Martin, R.A. Anderson, Compliant diaphragm material. US Patent #4,837,068 (1989)

2. Z. Kovac et al., Compliant interface for semiconductor chip and method therefor. US Patent #6,133,639 (2000)

3. E. Suhir, Electronic assembly having improved resistance to delamination. US Patent #6,028,772 (2000)

4. E. Suhir, Device and method of controlling the bowing of a soldered or adhesively bonded assembly. US Patent #6,239,382 (2001)

5. T.H. Di Stefano et al., Compliant microelectronic mounting device. US Patent #6,370,032 (2002)

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