Author:
Joseph T.,Uma S.,Philip J.,Sebastian M. T.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference58 articles.
1. I.J. Youngs, G.C. Stevens, A.S. Vaughan, J. Phys. D Appl. Phys. 39, 1267 (2006)
2. M. Pecht, R. Agarwal, F.P. McCluskey, T.J. Dishongh, S. Javadpour, R. Mahajan, Electronic Packaging Materials and Their Properties (CRC Press, London, 1999)
3. D.L. Chung, Materials for Electronic Packaging (Butterworth Heinemann, Washington, 1995)
4. R.R. Tummala, J. Am. Ceram. Soc. 74, 895 (1991)
5. J.D. Bolt, D.P. Button, B.A. Yost, Mater. Sci. Eng. A 109, 207 (1989)
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