Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test-Reference-Cited by-同舟云学术

Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test

Published:2013-11-07 Issue:1 Volume:25 Page:317-322
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Yeh Min-Chi,Li Jyun Lin,Lo Pei Jen,Yu Rick,Yu Cheng-Fu,Hsieh Ker-Chang

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-013-1588-1.pdf

Reference21 articles.

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2. P. Oberndorff, M. Dittes, L. Petit, in Proceedings of the IPC/Soldertec International Conference on Lead-Free Electronics Towards Implementation of the RHS Directive, Brussels,11–12 June 2003, pp. 170–178

3. R. Gedney, J. Smetana, N. Vo, G. Galyon, in Proceedings of the IPC/Soldertec Global 2nd International Conference on Pb-free Electronics, Amsterdam, The Netherlands, June 2004

4. I. Sakamoto, IEEE Trans. Electron. Packag. Manuf. 28(1), 10 (2005)

5. P. Oberndorff, M. Dittes, P. Crema, in Proceedings of the IPC/Soldertec Global 2nd International Conference on Pb-free Electronics, Amsterdam, the Netherlands, June 2004

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