The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test-Reference-Cited by-同舟云学术

The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

Published:2015-09-05 Issue:12 Volume:26 Page:10055-10061
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Lee Christine Jill,Chen Wei-Yu,Chou Tzu-Ting,Lee Tae-Kyu,Wu Yew-Chung,Chang Tao-Chih,Duh Jenq-Gong

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-015-3687-7.pdf

Reference27 articles.

1. T. Luo, Z. Chen, A. Hu, M. Li, Mater. Sci. Eng., A 556, 885–890 (2012)

2. S. Ahat, M. Sheng, L. Luo, J. Electron. Mater. 30, 1317–1322 (2001)

3. H.T. Lee, Y.H. Lee, Mater. Sci. Eng., A 419, 172–180 (2006)

4. C.M. Chuang, P.C. Shih, K.L. Lin, J. Electron. Mater. 33, 1–6 (2004)

5. I. Shohji, T. Yoshida, T. Takahashi, S. Hioki, Mater. Sci. Eng., A 366, 50–55 (2004)

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