Funder
National Natural Science Foundation of China
State Key Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering), China
A Project Funded by the Priority Academic Program Development of Jiangsu Higher Education Institution
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. S. Chada, Topics in lead-free solders: interfacial and Sn Whisker growth. J. Miner. Met. Mater. Soc. 64(10), 1174–1175 (2012)
2. L.L. Gao, S.B. Xue, L. Zhang et al., Effect of alloying elements on properties and microstructures of SnAgCu solders. Microelectron. Eng. 87(11), 2025–2034 (2010)
3. S.M. Hayes, N. Chawla, D.R. Frear, Interfacial fracture toughness of Pb-free solders. Microelectron. Reliab. 49(3), 269–287 (2009)
4. H. Ma, J.C. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44(5), 1141–1158 (2009)
5. N. Zhao, X.Y. Liu, M.L. Huang et al., Characters of multicomponent lead-free solders. J. Mater. Sci. 24(10), 3925–3931 (2013)
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献