Early stages of wetting of copper by Sn–Zn eutectic alloy-Reference-Cited by-同舟云学术

Early stages of wetting of copper by Sn–Zn eutectic alloy

Published:2018-10-17 Issue:24 Volume:29 Page:20531-20545
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Pstruś J.^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s10854-018-0197-4/fulltext.html

Reference58 articles.

1. Directive 2002/96/WE Parlamentu Europejskiego of 27 01 2003

2. Directive 2003/108/WE Parlamentu Europejskiego of 08 12 2003

3. Directive 2008/35/WE Parlamentu Europejskiego of 11 03 2008

4. Restrictions on the use of certain hazardous substances (RoHS) in electronic devices. https://www.dtsc.ca.gov/HazardousWaste/RoHS.cfm . Accessed 25 Dec 2016.

5. Management methods for restriction of the use of hazardous substances in electrical and E. products. http://www.chinarohs.com . Accessed 25 Dec 2016.

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