Funder
China Postdoctoral Science Foundation
Key Laboratory of Advanced Welding Technology of Jiangsu Province
the Priority Academic Program Development of Jiangsu Higher Education Institutions
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. H.Q. Wang, H. Zhao, D.P. Sekulic, Y.Y. Qian, A comparative study of reactive wetting of lead and lead-free solders on Cu and (Cu6Sn5/Cu3Sn)/Cu substrates. J. Electron. Mater. 37(10), 1640–1647 (2008)
2. J.C. Xu, et al., Study on microstructure and properties of Sn-0.3Ag-0.7Cu solder bearing Nd. J. Mater. Sci. (2016). doi:
10.1007/s10854-016-4901-y
3. J. Wang, H.M. Wei, P. He, T.S. Lin, F.J. Lu, Microstructure and mechanical properties of tin-bismuth solder reinforced by aluminum borate whiskers. J. Electron. Mater. 44(10), 3872–3879 (2015)
4. L. L. Gao, et al., Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder. J. Mater. Sci. 21(7), 643–648 (2010)
5. L. Zhang et al., Properties enhancement of SnAgCu solders containing rare earth Yb. Mater. Des 57, 646–651 (2014)
Cited by
36 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献