Synthesis and thermal analysis of aluminium nitride filled epoxy composites and its effective application as thermal interface material for LED applications-Reference-Cited by-同舟云学术

Synthesis and thermal analysis of aluminium nitride filled epoxy composites and its effective application as thermal interface material for LED applications

Published:2014-08-17 Issue:11 Volume:25 Page:4814-4821
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Anithambigai P.,Mutharasu D.,Huong L. H.,Zahner T.,Lacey D.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-014-2238-y.pdf

Reference32 articles.

1. C.H. Chao Chen, L.J. Yu, C.H. Yi, Opt. Express. 21, 3 (2013)

2. LED Professional Review, 2 (June 2007) Luger Research & LED professional

3. A. Poppe, G. Farkas, G. Molnár, B. Katona, T. Temesvölgyi, W.K. Jimmy, Proc. SPIE, 7784 (2010)

4. A. Poppe, G. Farkas, V. Székely, G. Horváth, M. Rencz, 22nd IEEE Meas. Power SEMI-THERM Symp. (2006)

5. A. Boudennea, L. Ibosa, M. Foisa, J.C. Majeste, E. Ge´hina, Compos. Part A. 36 (2005)

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. BeO in epoxy composites as TIM for high-power LED packages;Materials Science and Technology;2024-06-18

2. Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires;Materials;2023-07-20

3. Thermal dissipation network of hexagonal boron nitride platelets induced by low dielectric polymeric particles for millimeter wave devices;Sensors and Actuators A: Physical;2023-06

4. Experimental and Computational Analysis of Thermal Characteristics of Polymer Resin Reinforced with Rice Husk and Aluminium Nitride Filler Composites;Journal of The Institution of Engineers (India): Series D;2023-04-13

5. Epoxy-based composites with enhanced thermal properties through collective effect of different particle size fillers;Polymers and Polymer Composites;2022-01