Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages-Reference-Cited by-同舟云学术

Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages

Author:

Chen Liangbiao,Adams Jeremy,Chu Hsing-Wei,Fan Xuejun

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

Reference23 articles.

1. X.J. Fan, Moisture related reliability in electronic packaging (2005/2006/2007/2008 ECTC Professional Development Course Notes)

2. X.J. Fan, I. Bekar, A. Fischer, Y. He, Z. Huang, E. Prack, in Intel Conference on Manufacturing Excellence (IMEC) (San Diego, 2006)

3. Z. Huang, J. Tang, C. Hu, M. Wang, M. Zhang, B. Liu, X. Fan, E. Prack, in Intel Assembly Test Tech. Journal (2007)

4. X. Shi, X.J. Fan, in Proceedings of Electronic Components and Technology Conference (57th ECTC) (2007), pp. 1731–1736

5. B. Xie, X. Shi, X.J. Fan, in Prof. of 57th Electronic Components and Technology Conference (2007), pp. 242–248

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