Author:
Fukuda Shinji,Shimada Kazuhiko,Izu Noriya,Miyazaki Hiroyuki,Iwakiri Shoji,Hirao Kiyoshi
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. P. Dietrich, Trends in automotive power semiconductor packaging. Microelectron. Reliab. 53, 1681 (2013)
2. R. Zhang, R.W. Johnson, G. Muralidharan, D. Shaddock, T. Zhang, Effect of high temperature aging on microstructural evolution in AuSn solder joints. Mater. Sci. Technol. Conf. Exhib. 1, 142 (2011)
3. J. Hongjun, L. Minggang, L. Mingyu, in Ultrasonic-Assisted Soldering of Sn/Ni Composite Solder During Die Bonding for High-Temperature Application. IEEE Conf. Proc., ICEPT, p. 295 (2016)
4. H. Nishikawa, X. Liu, X. Wang, A. Fujita, N. Kamada, M. Saito, in Bonding Process Using Microscale Ag Particle Paste for Die Attach. IEEE Conf. Proc., ESTC, p. 1 (2016)
5. S.D. Peteves, M.G. Nicholas, Evaluation of brazed silicon nitride joints: microstructure and mechanical properties. J. Am. Ceram. Soc. 79, 1553 (1996)
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献