Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink-Reference-Cited by-同舟云学术

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Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink

Published:2023-11 Issue:33 Volume:34 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Zhuo Longchao^ORCID,Wang Qinghao,Sun Jiacheng,Feng Yaoyao,Yin Enhuai,Liu Wen,Chen Bingqing,Lin Samuel,Zhang Qiqi

Funder

Xi’an Advanced Manufacturing Technology Project

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-023-11628-8.pdf

Reference58 articles.

1. D. Gu, X. Shi, R. Poprawe, D.L. Bourell, R. Setchi, J. Zhu, Material-structure-performance integrated laser-metal additive manufacturing. Science. 372(6545), g1487 (2021)

2. E. MacDonald, R. Wicker, Multiprocess 3D printing for increasing component functionality. Science (2016). https://doi.org/10.1126/science.aaf2093

3. G. Fu, H. Gong, T. Bai, Q. Zhang, H. Wang, Progress and challenges in wearable electrochromic devices: a review. J. Mater. Sci. Mater. Electron. 34(16), 1316 (2023)

4. C.H. Rao, K. Avinash, B.K.S.V. Varaprasad, S. Goel, A review on printed electronics with digital 3D printing: fabrication techniques, materials, challenges and future opportunities. J. Electron. Mater. 51(6), 2747–2765 (2022)

5. C. Li, Y. Sun, M. Sun, B. Lin, X. Zhang, Novel cocklebur-like nano silver oxide for low-temperature curing pastes with dense conductive paths. J. Mater. Sci. Mater. Electron. 34(27), 1856 (2023)

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