Author:
Hasnine Md,Suhling Jeffrey C.,Bozack Michael J.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
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5. J. Zhang, Z. Hai, S. Thirugnanasambandam, J.L. Evans, M.J. Bozack, Y. Zhang, J.C. Suhling, Thermal aging effects on thermal cycling reliability of lead-free fine pitch packages. IEEE Trans. Compon. Packag. Technol. 3(8), 1348–1357 (2013)
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