Preparation of Cu-doped colloidal SiO2 abrasives and their chemical mechanical polishing behavior on sapphire substrates-Reference-Cited by-同舟云学术

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Preparation of Cu-doped colloidal SiO2 abrasives and their chemical mechanical polishing behavior on sapphire substrates

Published:2015-09-04 Issue:12 Volume:26 Page:10194-10200
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Lei Hong,Gu Qian

Funder

National Natural Science Foundation of China

National Natural Science Foundation of China (CN)

Doctoral Program of Higher Education of China

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-015-3708-6.pdf

Reference34 articles.

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2. T. Saitow, T. Hirayama, T. Yamamoto, Y. Ikuhara, J. Am. Ceram. Soc. 88(8), 2277–2285 (2005)

3. X.H. Niu, Y.L. Liu, B.M. Tan, L.Y. Han, J.X. Zhang, Trans. Nonferrous Metals Soc. 16, 732–734 (2006)

4. T. Takeuchi, H. Takeuchi, S. Sota, S. Sakai, H. Amano, I. Akasaki, Jpn. J. Appl. Phys. 36(2B), L177–L179 (1997)

5. W.X. Yan, Z.F. Zhang, X.H. Guo, W.L. Liu, Z.T. Song, ECS J. Solid State Sci. 4(3), P108–P111 (2015)

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