P–E hysteresis loop evaluation and dielectric studies of ceramic obtained from white rice husk ash for electronic applications-Reference-Cited by-同舟云学术

P–E hysteresis loop evaluation and dielectric studies of ceramic obtained from white rice husk ash for electronic applications

Published:2015-05-27 Issue:8 Volume:26 Page:6157-6162
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Bateni Nasim Heidari,Hamidon Mohd Nizar,Matori Khamirul Amin,Arab Ali

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-015-3196-8.pdf

Reference20 articles.

1. S. Nagata, H. Katsui, K. Hoshi, B. Tsuchiya, K. Toh, M. Zhao, T. Shikama, E.R. Hodgson, J. Nucl. Mater. 442, S501–S507 (2013)

2. S. Ramesh, B.A. Shutzberg, C. Huang, J. Gao, IEEE Trans. Adv. Packag. 26(1), 17–24 (2003)

3. L. Huitema, T. Monediere, Dielectric Material, Dr. Marius Alexandru Silaghi (Ed.) (2012). ISBN: 978-953-51-0764-4, In Tech, doi: 10.5772/50612

4. M. Sugimura, H. Imai, M. Kawasaki, K. Kamata, K. Fujii, Y. Fujito, S. Yonehara, A. Teramoto, S. Sugawa, T. Ohmi, In 2008 Electronic Components and Technology Conference. ECTC 2008. 58th 2008, IEEE Conference Publications 747–752 (2008)

5. S.O. Nelson, L.E. Stetson, J. Agric. Eng. Res. 21, 181–192 (1976)

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Activated carbon from rice husk with various activators for lithium-ion battery cathode material additive;INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING FOR EMERGING TECHNOLOGIES (ICOMEET 2021);2023

2. Effect of MgO Addition on the Mechanical and Dynamic Properties of Zirconia Toughened Alumina (ZTA) Ceramics;Materials;2019-07-31

3. Fabrication, performance and applications of integrated nanodielectric properties of materials – a review;Composite Interfaces;2017-08-08