Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards-Reference-Cited by-同舟云学术

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Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards

Published:2024-03 Issue:7 Volume:35 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Li Xinwei,Zhao Wenxia^ORCID,Cheng Yi,Liu Xin,Hui Kaihong,Zhao Wei,Song Yifan,Zhu Qian,Chen Huaijun,Cui Yubo

Funder

National Natural Science Foundation of China

Natural Science Foundation of Ningxia

Science and Technology Innovation Leading Talent Project of Ningxia

Ningxia New University Think Tank Project

Liupanshan Resources Engineering and Technology Research Center

Key Discipline of Inorganic Chemistry

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s10854-024-12283-3.pdf

Reference36 articles.

1. I. Volov, X. Sun, G. Gadikota, P. Shi, A.C. West, Electrochim. Acta. 89, 792–797 (2013). https://doi.org/10.1016/j.electacta.2012.11.102

2. A.A. Kosarev, A.A. Kalinkina, S.S. Kruglikov, T.A. Vagramyan, V.E. Kasatkin, J. Solid State Electrochem. 25, 1491–1501 (2021). https://doi.org/10.1007/s10008-021-04922-0

3. G. Frost, L. Ladani, J. Electron. Mater. 49, 1387–1395 (2020). https://doi.org/10.1007/s11664-019-07826-y

4. Z. Zhang, M.-C. Hsieh, R. Liu, J. Yeom, A. Suetake, H. Yoshida, C. Chen, J. Kang, H. Honma, Y. Kitahara, T. Matsunami, K. Otsuka, K. Suganuma, Microelectron. Reliab. 138, 114707 (2022). https://doi.org/10.1016/j.microrel.2022.114707

5. S. Ghosh, Thin Solid Films. 669, 641–658 (2019). https://doi.org/10.1016/j.tsf.2018.11.016

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