1. C.A. Harper, Electronic Packaging and Interconnection Handbook, 4rd ed. (McGraw-Hill Education, New York, 2005), pp. 93–97
2. X.F. Xu, J. Chen, J. Zhou et al., Adv. Mater. 30, 1705544 (2018)
3. J. Hansson, T.M.J. Nilsson, L.L. Ye et al., Int. Mater. Rev. 63, 22 (2018)
4. ITRS, The international technology roadmap for semiconductors 2.0, executive summary, 22 (2015)
5. M.A. Raza, A. Westwood, C. Stirling, J. Mater. Sci. 29, 8822 (2018)