1. T. Hu, J. Juuti, H. Jantunen, T. Vilkman, J. Eur. Ceram. Soc. 27, 3997 (2007)
2. D.L. Chung, Materials for Electronic Packaging (Butterworth Heinemann, Washington, 1995)
3. M. Pecht, R. Agarwal, F.P. McCluskey, T.J. Dishongh, S. Javadpour, R. Mahajan, Electronic Packaging Materials and there Properties (CRC Press, London, 1999)
4. M. Tian, Substrates for High Density Package Engineering (Tsinghua University Press, Beijing, 2003)
5. M.T. Sebastian, H. Jantunen, Int. J. Appl. Ceram. Technol. 7, 415 (2010)