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Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water

  • Published:2006-03 Issue:3 Volume:17 Page:219-227
  • ISSN:0957-4522
  • Container-title:Journal of Materials Science: Materials in Electronics
  • language:en
  • Short-container-title:J Mater Sci: Mater Electron

Author:

Yu D. Q.,Jillek W.,Schmitt E.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Harsanyi, G., IEEE Trans Comp., packag., Manufact. Technol. A, 18, 602 (1995)

2. Harsanyi, G., Microelectronics Reliability, 39, 1407 (1999)

3. Takemoto, T., Latanision, R. M., Eagar T. W., Matsunawa, A., Corrosion Science, 39, 1415 (1997)

4. Warren, G. W., Wynblatt, P., Zamanzadeh, M., Electron J., Mater. 18, 339 (1989)

5. Abtew, M., Selvaduray G.: Mater. Sci. Eng. R. 27, 95 (2000)

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