Design, Development, Fabrication, Packaging, and Testing of MEMS Pressure Sensors for Aerospace Applications-Reference-Cited by-同舟云学术

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Design, Development, Fabrication, Packaging, and Testing of MEMS Pressure Sensors for Aerospace Applications

Published:2014 Issue: Volume: Page:3-17
ISSN:2195-9862
Container-title:Springer Tracts in Mechanical Engineering
language:
Short-container-title:

Author:

Bhat K. N.,Nayak M. M.,Kumar Vijay,Thomas Linet,Manish S.,Thyagarajan Vijay,Pandian ,Jeyabal ,Gaurav Shyam,Gurudat ,Bhat Navakanta,Pratap Rudra

Publisher

Springer India

Link

http://link.springer.com/content/pdf/10.1007/978-81-322-1913-2_1

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advancement in Micromachining Techniques of MEMS Piezoresistive Pressure Sensors to Minimize Offset Drift Due to Humidity and Temperature;Industrial Engineering and Management;2024-05-29

2. Design and Fabrication of High Sensitivity MEMS Pressure Sensors for Aerospace Applications;2024 International Conference on Optimization Computing and Wireless Communication (ICOCWC);2024-01-29

3. Accuracy improvement for MEMS Piezoresistive Pressure Sensors;2023 International Conference on Control, Communication and Computing (ICCC);2023-05-19

4. Investigation of the Long-term Reliability of a Velostat-Based Flexible Pressure Sensor Array for 210 Days;IEEE Transactions on Device and Materials Reliability;2023

5. Investigation of the Mechanical Reliability of a Velostat-based Flexible Pressure Sensor;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10

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