Enhanced mechanical, thermal and dielectric properties of polyimide nanocomposites containing SiCp (SiCw) nanofillers for high energy-storage applications-Reference-Cited by-同舟云学术

Enhanced mechanical, thermal and dielectric properties of polyimide nanocomposites containing SiCp (SiCw) nanofillers for high energy-storage applications

Published:2022-10-01 Issue:11 Volume:29 Page:
ISSN:1022-9760
Container-title:Journal of Polymer Research
language:en
Short-container-title:J Polym Res

Author:

Zhang Zhao Xin,Yang Shang Ke,Shen Jun Wei,Yang Jia,Bian Jun,Zhang Ai Ping,Lin Hai Lan,Chen Dai Qiang

Funder

Cooperation project of Chunhui plan of the ministry of education of China

Innovation research studio project for College Students of Xihua University

Key Research Institute of Humanities and Social Sciences in Sichuan Province

“Xihua cup” innovation and entrepreneurship project of Xihua University

Graduate Innovation Fund of Xihua University

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://link.springer.com/content/pdf/10.1007/s10965-022-03297-8.pdf

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