Preparation of high temperature resistant Ag/PI/Cu composite nano particles inserted with PI insulating layer
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Organic Chemistry,Polymers and Plastics
Link
http://link.springer.com/article/10.1007/s10965-018-1631-2/fulltext.html
Reference22 articles.
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2. Lin Y-S, Chiu S-S (2004) Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications. Polymer Engineering & Science. 44:2075. https://doi.org/10.1002/pen.20212
3. Lin Y-S, Chiu S-S (2004) Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles. Journal of Adhesion Science and Technology 93:2045. https://doi.org/10.1163/156856108X320537
4. Zhang C, Wang R, Cai Z, Peng C, Wang N (2015) Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles. Journal of Materials Science Materials in Electronics. 26(18). https://doi.org/10.1007/s10854-014-2381-5
5. Luo X, Gelves GA, Sundararaj U, Luo J-L (2012) Silver-coated copper nanowires with improved anti-oxidation property as conductive fillers in low-density polyethylene. The Canadian Journal of Chemical Engineering. 91. https://doi.org/10.1002/cjce.21701
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