Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrochemistry,General Chemical Engineering
Reference15 articles.
1. Chu W., Smith H.I., Rishton S.A., Kern D.P., Schattenburg M.L. (1992) J. Vac. Sci. Technol. B 10:118
2. Jasper J., Shiels D. (2000) Eur. Semicond. 22:86
3. Okinak Y., Hoshino M. (1998) Gold Bull. 31:3
4. P.A. Kohl, in M. Schlesinger and M. Paunovic (Eds), ‘Modern Electroplating’ (J. Wiley & Sons, New York, 4th edn, 2000), 207 pp
5. Velu E., Dupas C., Renard D., Renard J.P., Seiden J. (1998) Phys. Rev. B: Condens. Matter 37:668
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