Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining-Reference-Cited by-同舟云学术

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Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining

Published:2019-12-18 Issue:2 Volume:50 Page:169-184
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Patro Subrat Kumar,Mishra Dileep Kumar,Arab Julfekar,Dixit Pradeep^ORCID

Funder

Ministry of Human Resource Development

Department of Scientific and Industrial Research, Ministry of Science and Technology

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s10800-019-01380-5.pdf

Reference26 articles.

1. Sugioka K, Cheng Y, Midorikawa K (2005) Three-dimensional micromachining of glass using femtosecond laser for lab-on-a-chip device manufacture. Appl Phys A 81:1–10

2. Lee J-Y, Lee S-W, Lee S-K, Park J-H (2013) Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging. J Micromech Microeng 23:85012

3. Choi JP, Jeon BH, Kim BH (2007) Chemical-assisted ultrasonic machining of glass. J Mater Process Technol 191:153–156

4. Jalali M, Maillard P, Wüthrich R (2009) Toward a better understanding of glass gravity-feed micro-hole drilling with electrochemical discharges. J Micromech Microeng 19:45001

5. Mishra DK, Arab J, Magar Y, Dixit P (2019) High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique. ECS J Solid State Sci Technol 8:P322–P331

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