Study of an alkaline bath for tin deposition in the presence of sorbitol and physical and morphological characterization of tin film-Reference-Cited by-同舟云学术

Study of an alkaline bath for tin deposition in the presence of sorbitol and physical and morphological characterization of tin film

Published:2005-12-17 Issue:4 Volume:36 Page:403-409
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Broggi R. L.,Oliveira G. M. de,Barbosa L. L.,Pallone E. M. J. A.,Carlos I. A.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s10800-005-9086-7.pdf

Reference19 articles.

1. Lowenheim F. (1974). Modern Electroplating. John Wiley and Sons, New York

2. Tin Research Institute. Instruction for Electrodepositing Tin, 5th ed., 1979. in T.M.C. Nogueira, Ph.D. Thesis, Universidade Federal de São Carlos, Brazil (1996)

3. Hirsch S. Tin–lead, lead and tin plating. Special Metal Finishing-Guide and Directory Issue. 93(1A) (1995) 304

4. J.P. Nityanandan and H.V.K., Metal Finish. July (1973) 44

5. C. Rosenstein, Metal Finish. January (1990) 17

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