Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrochemistry,General Chemical Engineering
Reference46 articles.
1. Ye X, Bonte MD, Celis JP, Roos JR (1992) Role of overpotential on texture, morphology and ductility of electrodeposited copper foils for printed circuit board applications. J Electrochem Soc 139(6):1592–1600
2. Shen L, Zhao B, Zhang B, Liu A, Shi Z, Hu X, Boča M (2018) Preparation of fine copper powder by plasma discharge electrolysis process. J Electrochem Soc 165(11):E527–E533
3. Dalapati GK, Masudy-Panah S, Chua ST, Sharma M, Wong TI, Tan HR, Chi D (2016) Color Tunable Low Cost Transparent Heat Reflector Using Copper and Titanium Oxide for Energy Saving Application. Sci Rep 6(1):20182
4. Awad, A.; Abd-El–Rahman, A. M.; Rafea, M. A. Characterization of Nano/Micro Size Copper Powder Bi-Product of Electropolishing Process. J. Am. Sci. 2010, 6 (9), 137–143.
5. Maksimović, V. M.; Pavlović, Lj. J.; Pavlović, M. G.; Tomić, M. V. Characterization of Copper Powder Particles Obtained by Electrodeposition as Function of Different Current Densities. J. Appl. Electrochem. 2009, 39 (12), 2545.
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献