A highly stabilized–inhibited nitric acid/ferric nitrate-based solder stripping solution-Reference-Cited by-同舟云学术

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A highly stabilized–inhibited nitric acid/ferric nitrate-based solder stripping solution

Published:2006-08-01 Issue:9 Volume:36 Page:1043-1049
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Shaigan N.,Ashrafizadeh S.N.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s10800-006-9157-4.pdf

Reference32 articles.

1. R. Singh, N. Mandich and G. Krulik, Solder and tin stripper composition. US Patent No. 5,512,201 (1996)

2. Shaigan N., Ashrafizadeh S.N., Bafghi M.S., Rastegari S. (2005) J. Electrochem. Soc. 152: C173

3. C.H. Dixon, Composition for stripping lead–tin solder. US Patent No. 3,990,982 (1976)

4. C.H. Dixon, Method for preparing printed circuit boards with terminal tabs. US Patent No. 3,841,905 (1974)

5. Jr. Brindisi, J.S. Nagy and E.F. Yarkosky, Selectively stripping tin and/or lead from copper substrates. US Patent No. 3,677,949 (1970)

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1. The recovery of copper and tin from waste tin stripping solution;Separation and Purification Technology;2009-08

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