Comparison of the bonding strengths of second- and third-generation light-emitting diode light-curing units
Author:
Affiliation:
1. Department of Orthodontics, College of Dentistry, Wonkwang University, Iksan, Korea.
2. Department of Orthodontics, Wonkwang University Daejeon Dental Hospital, Daejeon, Korea.
Publisher
Korean Association of Orthodontists
Subject
Orthodontics
Link
http://synapse.koreamed.org/pdf/10.4041/kjod.2016.46.6.364
Reference28 articles.
1. Light curing through glass ceramics with a second- and a third-generation LED curing unit: effect of curing mode on the degree of conversion of dual-curing resin cements
2. Effect of curing time on the bond strength of a bracket-bonding system cured with a light-emitting diode or plasma arc light
3. Shear bond strength of orthodontic brackets bonded with light-emitting diode curing units at various polymerization times
4. State-of-the-art: Dental photocuring—A review
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